A1kpixel CMOS Camera Chip for 25fps Real-Time THz Imaging Applications
Speaker: Andreia Cathelin , ST MicroclectronicsContact:
Date: March 6 2012
Time: 3:30PM to 4:30PM
Location: 32-G449 Patil/Kiva
Host: Dina Katabi, CSAIL
Mary McDavitt, 617-253-9620, email@example.com
ABSTRACT: Future imaging applications in the submillimeter-wave range (300GHz-3THz) require RF systems, which can achieve high sensitivity and portability at low power consumption levels. In particular CMOS process technologies are attractive due to their low price-tag for industrial, surveillance, scientific, and medical applications. Recently, CMOS based detectors have shown good sensitivity up to 1THz with NEPs on the order of 66pW/sqrt(Hz) at 1THz. However, CMOS terahertz imagers developed thus far have only operated single detectors based on lock-in measurement techniques to acquire raster-scanned images with frame rates on the order of minutes. To address these impediments, we present a low-power 1k-pixel terahertz camera chip fully compliant with an industrial 65nm Ft/fmax=160GHz/200GHz CMOS process technology. The active pixel circuit topology is designed to accommodate the optics for wide bandwidth (0.6-1THz) in stand-off detection with a 40dBi Si-lens. It includes row/column select and integrate-and-dump circuitry capable of capturing terahertz images with video frame rates up to 25fps at a power consumption of 2.5µW/pixel.
BIO: Andreia Cathelin (M’04, SM’11) started her electronic studies at the Polytechnic Institute of Bucarest, Romania and graduated from the Institut Supérieur d’Electronique du Nord (ISEN), Lille, France in 1994. In 1998, she received the Ph. D. degree from IEMN/ISEN, Lille, France regarding the work on a fully-integrated BiCMOS low power – low voltage FM/RDS receiver.
From 1997 till 1998, she was with Info Technologies, Gradignan, France, working on analog and RF communications design. Since 1998, she has been with ST Microelectronics, Crolles, France, now in the Technology R&D, Central CAD and Design Solutions, Innovation & External Research design team.
Andreia is a senior design expert and her major fields of interest are RF and mmW systems for wireless communications, MEMS devices co-integration and SOI technologies. She is a member of the Technical Program Committee of ISSCC, VLSI Symposium on Circuits and ESSCIRC, and serves as chair for the RF sub-committee at ISSCC 2012. She is member of the experts’ team of the AERES (French Evaluation Agency for Research and Higher Education). She has authored or co-authored more than 80 technical papers and 2 book chapters, and has filed more than 20 patents.
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